• 比特28

    About US
    Company Founded in 2008, the company has a registered capital of RMB 122,574,975. It was listed on the Sci-Tech Innovation Board (STAR Market) of the Shanghai Stock Exchange on February 10, 2022, with the stock code: 688261.
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    Products

    All products

    The company's main products include the GreenMOS series of Super Junction MOSFETs, SFGMOS and FSMOS series of Shielded Gate MOSFETs, TGBT, SuperSi²C MOSFETs, SuperSi MOSFETs and SiC MOSFETs. These products are widely applicable to industrial and automotive-grade application scenarios, represented by new energy vehicle DC charging piles, on-board chargers (OBC), photovoltaic inverters, energy storage systems, 5G base station power supplies, telecom power supplies, data center server power supplies, industrial lighting power supplies, power tools, intelligent robots, unmanned aerial vehicles (UAV) and UPS power supplies. They are also used in consumer electronics applications such as PC power supplies, adapters, TV power boards, fast chargers for mobile phones and electromagnetic heating products.

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    SJ MOSFETs

    In order to meet the demand of high efficiency and minification of power supply system, Oriental Semiconductor has launched a new GreenMOS series of high voltage MOSFET, which adopts unique patented device structure and manufacturing process. GreenMOS product has faster switching speed and softer switching curve than conventional MOSFET, which can greatly restrain switch oscillation while obtaining extremely low dynamic loss. It can not only greatly improve system efficiency and reduce heating, but also simplify system EMI design.

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    SGT MOSFETs

    Oriental Semiconductor’s SFGMOS Series MOSFET adopts Semi-Floating Gate structure, which combines the advantages of traditional planar structure and SGT structure of power MOSFET, and has the advantages of higher process stability and reliability, faster switching speed, smaller gate charge and higher application efficiency. SFGMOS Series MOSFET products cover the whole series of 20V~200V, which can be widely used in motor driver, synchronous rectification, etc.

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    IGBTs

    Oriental Semiconductor's IGBT chips adopt a unique Trident-Gate Bipolar Transistor (TGBT) device structure to achieve lower on-state voltage drop and reduced switching losses.Multiple series of first and second-generation TGBT products have been successively launched, covering voltage ranges from 600V to 1700V. These products are suitable for applications such as photovoltaic energy storage inversion, DC charging piles, automotive main drive, OBC, and UPS. Additionally, Oriental has developed an ultra-high-speed series TGBT with an operating frequency of 60-100 kHz, which meets the demands of further high-frequency power systems while delivering higher efficiency.

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    Trench MOSFETs

    Trench MOSFET: Reliable and Trustworthy Performance Through extensive development,we continuously expand our product portfolio with advanced small signal MOS and power MOS solutions. Our comprehensive product portfolio provides the flexibility needed in today's market, easily choose the product that best suits for you. Our leading technology ensures the highest reliability and performance, while advanced packaging enhances resistance and thermal performance while reducing size and costs.

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    Power Module

    Advanced power modules, including IGBTs, MOSFETs, SiC, Si/SiC hybrid modules, diodes, SiC diodes, and intelligent power modules. IGBT modules are used in applications such as main drive and DC-AC class solar inverters, energy storage systems, uninterruptible power supplies, and motor drives. MOSFET modules are used in automotive motor drives and on-board charger applications, with voltage ratings of 40 V, 60 V, 80 V, and 650 V, and use super-junction technology and inductive resistors.

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    SiC MOSFETs

    Third-generation semiconductor material power devices are one of the important components of high-performance power devices in the future. The R&D team of Oriental has rich experience in wide bandgap semiconductor research and has developed a series of SiC MOSFETs.

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    GaN HEMT

    Gallium Nitride High Electron Mobility Transistors (GaN HEMT) are increasingly becoming the choice for mainstream markets. For various high-voltage and low-voltage application scenarios, GaN HEMTs offer the fastest switching capabilities (with the highest dv/dt and di/dt) and superior energy efficiency performance. In addition, the self-developed GaN HEMTs by Oriental Semiconductor Co., Ltd. have reduced conduction losses and switching losses through innovative designs, further improving power density.

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    Power IC

    When connected in series with a power source, the OSP5050 high side OR-ing FET controller is used in conjunction with an external NMOSFET as an ideal diode rectifier. This OR-ing controller allows MOSFETs to replace diode rectifiers in distribution networks, thereby reducing power loss and voltage drop.

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    Application
    Application The products of Oriental Semiconductor cover a wide and specific range of application fields. In automotive electronics, the company has made in-depth deployment in electrification, covering on-board charging, various electronic control systems and thermal management. In the industrial and energy sectors, it provides solutions for battery testing, photovoltaic inversion and industrial power supplies. Meanwhile, its products also serve multiple key industries including consumer electronics (e.g., fast charging, televisions), household appliances (e.g., refrigerators, vacuum cleaners), communication facilities (e.g., data center power supplies) and motor drives (e.g., robots, UAVs, forklifts).
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    Quality Management
    Quality Management Date of Certification for ISO 9001 Quality Management System: January 11, 2016. Date of Certification for CNAS 17025 Laboratory Management System: March 3, 2025
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    Investor Relations
    Investor Relations Oriental Semiconductor is committed to establishing an effective communication mechanism with investors. Through transparent, timely and accurate information disclosure and communication, we help investors gain a comprehensive and objective understanding of the company’s strategies, operating status, financial performance and future development prospects. We ensure that all investors receive information of equal quality, build trusting relationships with them, and thereby enable the company’s intrinsic value to be reasonably reflected in the capital market.
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    Application
    Robotics
    Robotic Vacuum Cleaners

    Robotic Vacuum Cleaners

    With the rapid development of science and technology, driven by modern technological advances, robotic vacuum cleaners have evolved into multi-functional household cleaning appliances that integrate sweeping, suction, and mopping functions. Equipped with intelligent sensors and cleaning systems, they can independently or with minimal human intervention complete floor sweeping and vacuuming tasks.

    Block Diagram
    Design Features

    Precise robotic vision and sensing for an intelligent user experience.

    Highly reliable battery protection, power monitoring, supervision and charging systems.

    Efficient, compact and precise motor control.

    Product Selection

    Type Model Number Parameters Package
    SGTMOSSFS04R021GF40V/2.1mRPDFN5X6
    SGTMOSSFS06R015UGSCNF60V/1.5mRPDFN5X6
    SGTMOSSFS06R09NF60V/9mRPDFN3.3X3.3
    SGTMOSSFS06R014UGNF60V/9mRPDFN5X6
    Trench MOSOSH03P13NF-30V/14mRPDFN3.3X3.3
    Trench MOSOSH04N057GF40V/5.7mRPDFN5X6
    Trench MOSOSH3134KDW20V/250mRPDFN5X6
    Selected for you

    New Product

    OSG65R019H4T3ZFUltra-low internal resistance enables higher power conversion efficiency

    OSQ65R055H4T3NF_NB0V Turn-off, SiC Compatible with General-Purpose Driver Chips

    SFS08R023UGSCNFUltra-low thermal resistance meets the demand for higher power density

    Application

    On-Board Charger (OBC)High Power Density and Lightweight Design

    PD Chargers & AdaptersUltimate Breakthroughs in Power and Efficiency, Currently Supporting the Maximum Specifications of the Mainstream PD3.0 Standard

    Battery Formation and TestingFocuses on technological innovation in semiconductor devices

    Quality Control

    Quality PolicyContinuously provide customers with the most valuable products and services

    Quality ManagementContinuously improve product and service quality

    Quality StatementMeet customer needs, exceed customer expectations, and achieve win-win cooperation, coexistence and long-term development with customers

    Package Innovation

    T2PAKSurface-mount SiC Enables Lower Parasitic Inductance in Power Circuits

    QDPAKTop-side Cooling Package Delivers Superior Thermal Management Performance

    DSCPPAK5*6Ultra-low thermal resistance meets the demand for higher power density

    News
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    Shanghai SiC Summit Kicks Off | Oriental Semi Invites You to Explore New Opportunities in Data Center Upgrading 2026-05-26
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    Oriental Semi Wins xFusion’s Best Delivery Award, Joining Hands to Build a New Ecosystem of Computing Power Infrastructure 2026-05-21
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    Oriental Semi × Hynetek Official Announcement!Join Us at the 2026 Global AI Server Power Supply Summit 2026-05-15
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    Suzhou Headquarters

    Address:Building 65, Southeast Zone, Suzhou Nano City,No. 99 Jinji Lake Avenue, Suzhou Industrial Park
    Telephone:0512-62534962
    Email:enquiry@51fenfeng.com

    Shenzhen Application Support Center

    Address:Room 1905, 19th Floor, Building A7, Chuangzhi Cloud City,Xili Sub-district, Nanshan District, Shenzhen
    Telephone:0755-83229660
    Email:robin.lu@51fenfeng.com

    About US
    Company History Social Responsibility News Contact Us Join Us
    Products
    SJ MOSFETs SGT MOSFETs IGBTs Trench MOSFETs Power Module SiC MOSFETs GaN HEMT Power IC
    Application
    Automotive Electronics Power Supplies for Data Center AIDC Consumer Electronics Industrial Applications Household Appliances Communication Technology Motor Drives Robotics
    Quality Management
    Quality Policy Partner Portal Quality Management Quality Statement
    Investor Relations
    Investor Relations Equity Structure Management Team Financial Quick View Investor Communications

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